Wafer edge inspection

Features

  • Reliable defect detection
  • 2 – 5 mm of the wafer edge
  • high resolution image processing system
  • Finds particles, cracks, scratches, point-shaped and flat defects, etching defects, crystal growth, contamination and geometry deviations
Contact

MICRO-EPSILON
UK & Ireland Ltd.

+44 151 355 6070

Send email

Downloads
info@micro-epsilon.co.uk