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Watchlist (0)Wafer edge inspection
The wafer edge inspection system measures the surface of the wafer with high precision using three image processing cameras. Defects larger than 300 nm are thus reliably detected. Defective wafers can significantly affect later process steps and result in shutdown of the production.
Features
Reliable defect detection
2 – 5 mm of the wafer edge
high resolution image processing system
Finds particles, cracks, scratches, point-shaped and flat defects, etching defects, crystal growth, contamination and geometry deviations
MICRO-EPSILON
UK & Ireland Ltd.
+44 151 355 6070
+44 151 355 6075
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