Highly precise displacement sensors for OEM series applications in semiconductor engineering
Sensor technology by Micro-Epsilon has been used successfully in the semiconductor industry for many years, with the right solution for any measurement task: We offer ultra-precise sensors for complex front-end processes, back-end applications and wafer handling automation. Our sensor solutions stand out thanks to their high accuracy, reliability, and long-term stability – even under challenging process conditions in the various manufacturing environments.
Why Micro-Epsilon?
- More precision down to the picometre – Made in Germany
- Consulting, development & production from a single source
- Together with our customers: quality and problem-solving expertise in series & OEM
- In-depth technology and application knowledge in the field of semiconductor production
- Modern manufacturing methods for highly precise displacement sensors and sensor systems
Optimized sensors for OEM series applications
For series applications, we modify our sensors according to your specifications, e.g. changes to the cable, sensor material and design as well as to the controller. In addition, application-specific sensor materials are also used.
Typical sensor specs for series applications:
- Vacuum-compatible: low-outgassing materials and UHV-compliant manufacturing technologies
- Special connection technologies
- Labeling and packaging in compliance with semiconductor industry standards
- Performance optimization for exceptional measurement accuracy
- Maximum resistance to electromagnetic fields
- High quality assurance standards across all process steps
Ready for Semicon – optimized production methods
All sensors and systems undergo complex manufacturing and testing procedures. This relates, among other things, to the selection and placement of the electronics, the mechanical manufacturing procedure and special process technology.
Highly specialized manufacturing methods
- USP laser technology
- High-temperature vacuum brazing
- Mechanical precision manufacturing
- Burn-in tests
- Fully automated potting lines
- Passivation and coating of components and switch groups
- Specialized cleaning processes
Embedded coil technology
For particularly demanding OEM projects, we recommend embedded coil technology or embedded capacitor technology (ECT). Thanks to the miniaturized sensor design in inorganic material, almost all degrees of freedom are possible for the outer shape. And due to the ceramic substrate, the sensors are mechanically robust and extremely stable. If necessary, the entire evaluation electronics can be integrated in the sensor. This makes it possible to adapt ECT sensors to special installation situations. The ECT sensors are suitable for the harshest of use conditions and have proven their worth in numerous applications.
More precision for the semiconductor industry
Micro-Epsilon offers the right solution for diverse applications in the semiconductor industry – from high-precision optics positioning and stage alignment to hybrid bonding. The sensors are used in both front-end and back-end processes and stand out thanks to their supreme precision and reliability.
